Reviews Thermal Component

Thermopad Thermal Grizzly Minus Pad 8 - Silicone, Self-Adhesive, Thermally Conductive Thermal Pad - Conducts Heat and Cools The Heating Elements of The Computer or Console (100 × 100 × 2,0 mm)

  • ...te that is originally used by Apple. K5-PRO can replace soft thermal pads that are used on computers (up to 3mm thick).
  • K5-PRO has thermal conductivity K>5,3 W/m.K * (at least 3 times higher than common thermal pads that are used on computers and commercial electronics) .K5-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 250 degrees (Celsius) and has a long operational life time (practically infinite after the installation).
  • K4-PRO is a high quality thermal paste designed for use on computer BGA components (GPU, CPU, etc).K4-PRO is a very low viscosity thermal paste (especially when heated during the fist use). It will cover all the invisible gaps between the component and the heatsink without creating a film of paste like most low cost thermal pastes..
  • K4-PRO has thermal conductivity K>4,6 W/m.K * (3 times higher than common thermal pastes that are used on computers and commercial electronics).K4-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 220 degrees (Celsius) and has a long operational life time (practically infinite).
  • Computer Systems matterials science laboratory testing : Method using a comparative technique (P. Karyd....
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K4-PRO 500g high Thermal Conductivity Thermal Paste K 4,6 W/m.K for Computer heatsinks Ideal for laptops and Apple iMac

  • K4-PRO is a high quality thermal paste designed for use on computer BGA components (GPU, CPU, etc)..
  • K4-PRO has thermal conductivity K>4,6 W/m.K (3 times higher than common thermal pastes that are used on computers and comercial electronics) Computer....
  • K4-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 220 degrees (Celcium) and has a....
  • K4-PRO is produced in EU (Thessaloniki, Greece) and can be shipped to your location worldwide very fast. We use a 4th day delivery service worldwide..
  • K4-PRO is a very low viscosity thermal paste (especially when heated during firs use). It will cover the invisible gaps between heatsink and component....
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Silver Thermal Grease CPU Heatsink Compound Paste Syringe 5-pack

  • SAFETY APPLICATION: SYY is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card..
  • BETTER THAN LIQUID METAL: Thermal Conductivity:15.7W/m-k, it is composed of carbon particles and has extremely high thermal conductivity. It ensures....
  • THERMAL COMPOUND: SYY thermal paste Edition 2020 formula has excellent component heat dissipation performance and has the stability to push the system....
  • EASY TO APPLY: SYY thermal paste has ideal consistency and is very easy to use even for beginners..
  • HIGH DURABILITY: In contrast to metal and silicon thermal conductive adhesives, SYY thermal paste 2020 will not compromise over time. After applying,....
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Thermal Paste CPU Thermal Compound,4 Grams Heatsink Paste for IC/Processor/CPU/All Coolers Carbon Based High Performance Thermal Interface Material

  • Safety Application: Foriston thermal paste is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to....
  • Better Than Liquid Metal : This thermal paste is composed of carbon particles and has extremely high thermal conductivity. It ensures that the heat....
  • Thermal Compound : Foriston thermal paste Edition 2021 formula has excellent component heat dissipation performance and has the stability to push the....
  • Easy to Apply : Foriston thermal paste has ideal consistency and is very easy to use even for beginners..
  • High Durability: In contrast to metal and silicon thermal conductive adhesives, Foriston thermal paste 2021 will not compromise over time. After....
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Noctua NH-D15 chromax.Black, Dual-Tower CPU Cooler (140mm, Black)

  • SAFETY APPLICATION: SYY is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card..
  • BETTER THAN LIQUID METAL: It is composed of carbon particles and has extremely high thermal conductivity. It ensures that the heat generated by the CPU or GPU is effectively dissipated..
  • THERMAL COMPOUND: SYY thermal paste 2022 edition has excellent component heat dissipation performance and has the stability to push the system to the limit..
  • EASY TO APPLY: SYY thermal paste has ideal consistency and is very easy to use even for beginners..
  • HIGH DURABILITY: In contrast to metal and silicon thermal conductive adhesives, SYY thermal paste 2022 will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years..
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Thermal Grizzly - Spatula for Applying and Spreading Thermal Paste or Liquid Metal on CPU, GPU and Heatsinks - Thermal Paste Spreader - 3 Pieces

  • Suitable for all Thermal Grizzly pastes: Aeronaut, HYDRONAUT, KRYONAUT and KRYONAUT EXTREME.
  • This thermal paste applicator allows for an even and precise distribution of the paste on the processor without risk of introducing contamination.
  • Correct thermal paste application is essential to achieve optimum thermal paste conductivity characteristics.
  • In addition to higher clock speeds, products with better thermal conductivity enable quieter cooling and longer component life.
  • Compatible not only with computers or laptops, but also with PS3, PS4, PS5, Xbox 360, One and Series X consoles.
  • Perfectly dissipates the heat from your Macbook.
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BSFF Thermal Paste, 1.8g CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

  • SAFETY APPLICATION: BSFF is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card..
  • BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently..
  • HIGH DURABILITY: BSFF thermal paste Edition 2023 formula has excellent component heat dissipation performance and has the stability to push the system to the limit..
  • EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste 2023 will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years..
  • EASY TO APPLY: BSFF thermal paste has ideal consistency and is very easy to use even for beginners.
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Thermal Paste, SYY 2 Grams CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, 15.7W/m.k Carbon Based High Performance, Thermal Interface Material, CPU Thermal Paste

  • SAFETY APPLICATION: SYY is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card..
  • BETTER THAN LIQUID METAL: Thermal Conductivity:15.7W/m-k, it is composed of carbon particles and has extremely high thermal conductivity. It ensures that the heat generated by the CPU or GPU is effectively dissipated..
  • THERMAL COMPOUND: SYY thermal paste Edition 2020 formula has excellent component heat dissipation performance and has the stability to push the system to the limit..
  • EASY TO APPLY: SYY thermal paste has ideal consistency and is very easy to use even for beginners..
  • HIGH DURABILITY: In contrast to metal and silicon thermal conductive adhesives, SYY thermal paste 2020 will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years..
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BSFF Thermal Paste, 3.5g with Toolkit CPU Paste Thermal Compound Paste Heatsink for IC/Processor/CPU/All Coolers, Carbon Based High Performance

  • SAFETY APPLICATION: BSFF is metal-free and non-conductive, which eliminates any risk of short circuit and adds more protection to the CPU and VGA card..
  • BETTER THAN LIQUID METAL: It is made of carbon microparticles, guaranteeing extremely high thermal conductivity. This ensures that heat from the CPU/GPU is dissipated quickly & efficiently..
  • HIGH DURABILITY: BSFF thermal paste Edition 2022 formula has excellent component heat dissipation performance and has the stability to push the system to the limit..
  • EXCELLENT PERFORMANCE: In contrast to metal and silicon thermal conductive adhesives, BSFF thermal paste 2022 will not compromise over time. After applying, you do not need to apply again because it will last at least 5 years..
  • EASY TO APPLY: BSFF thermal paste has ideal consistency and is very easy to use even for beginners.
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Inland Premium 512GB NVMe SSD Bundle with PowerSpec 650W PC Power Supply M.2 2280 PCIe Gen 3.0x4 3D NAND Internal Solid State Drive Combo with Semi Modular ATX PSU 80PLUS Bronze Certified 135mm Fan

  • NVMe SSD and Computer Power Supply Gaming Bundle, meeting your needs of high speed and stable power supply at great energy efficiency when gaming.....
  • Component 1: Inland Premium 512GB M.2 2280 SSD, PCIe NVMe 3.0 x4 3D NAND internal solid state drive, high Speed read/write speed up to 3100MB/s and....
  • Component 1: No overheat and quiet when working compares to HDD. Tiny M.2 form factor with no moving parts inside, make it widely compatible,....
  • Component 2: PowerSpec 650 Watt Semi-Modular ATX Power Supply with 135mm RGB Lighting Fan. Certified 80 Plus Bronze power efficiency. Active PFC with....
  • Component 2: High-quality components ensure long-lasting durability and reliability. Great ventilation avoids potential thermal and noise problems.....
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K5 PRO Viscous Thermal Paste for Thermal pad Replacement 60g 3X20g Pack iPhone Apple iMac Sony PS4 & PS3 Xbox Acer Aspire etc

  • K5-PRO is a high quality gummy / sticky thermal paste designed for use on memory chips and GPUs of various computers including iPhone, Acer Aspire....
  • K5-PRO can replace soft thermal pads that are used on computers (up to 3mm thick).
  • K5-PRO has thermal conductivity K>5,3 W/m.K (at least 3 times higher than common thermal pads that are used on computers and comercial electronics)....
  • K5-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 250 degrees (Celcium) and has a....
  • Expiration date: No expiration date (new formula). Infinite storage / service life. Protect from frost and dust.
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Computer-Systems K5 PRO Viscous Thermal Paste for Thermal pad Replacement 10g (iPhone, Apple iMac, Sony PS4 & PS3, Xbox, Acer Aspire etc)

  • K5-PRO is a high quality gummy / sticky thermal paste designed for use on memory chips and GPUs of various computers including iPhone, Acer Aspire 6930 , Apple iMac A1311 video boards. This is the only comercially avaliable product at the moment that can replace the gummy thermal paste that is originally used by Apple..
  • K5-PRO can replace soft thermal pads that are used on computers (up to 3mm thick).
  • K5-PRO has thermal conductivity K>5,3 W/m.K (at least 3 times higher than common thermal pads that are used on computers and comercial electronics) Computer Systems materials science laboratory testing : Method using a comparative technique (P. Karydopoulos, P. Frantzis, N. Karagiannis MSAIJ 2014).
  • K5-PRO is applied very easily directly on the component and has no electrical conductivity. It can be heated up to 250 degrees (Celcium) and has a long operational life time (practically infinite).
  • Expiration date: No expiration date (new formula). Infinite storage / service life. Protect from frost and dust.
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ATI FireGL V8650 2 GB Dual-DVI PCI-Express Video Card 100-505569

  • Powered by AMD’s Scaleable ATI FireGL Graphics Accelerator with Parallel Processing Unified Shader Architecture AutoDetect Instinctively Optimizes.
  • High Dynamic Range (HDR) Rendering with 8-bit, 10-bit & 16-bit per RGB Color Component Support CAD and DCC Application Certification.
  • Chipset: FireGL V8650 Engine Clock: 688 MHz Video Memory: 2GB DDR4 Memory Clock: 1.736 GHz Memory Interface: 512-bit.
  • Memory Bandwidth: 111 GB/sec Bus: PCI-Express x16 RAMDAC: 400 MHz Shader Processing Units: 320 Max. Resolution: 2560 x 1600.
  • Stereoscopic 3D Output Thermal: Fansink Support Microsoft DirectX 10, Shader Model 4.0 and OpenGL 2.1 Requirements: 3650Watt Power Supply required for ATI FireGL V8650.
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